IEC 63287-1-2021 Semiconductor devices – Generic semiconductor qualification guidelines – Part 1: Guidelines for IC reliability qualification

IEC 63287-1-2021 Semiconductor devices – Generic semiconductor qualification guidelines – Part 1: Guidelines for IC reliability qualification. This part of IEC 63287 gives guidelines for reliability qualification plans of semiconductor integrated circuit products. This document is not intended for military- and space-related applications. NOTE 1 The manufacturer can use flexible sample sizes to reduce cost and maintain reasonable reliability by this guideline adaptation based on EDR-4708, AEC Q1 00, JESD47 or other relevant document can also be applicable if it is specified. NOTE 2 The Weibull distribution method used in this document is one of several methods to calculate the appropriate sample size and test conditions of a given reliability project. 2 Normative references The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60749-5, Semiconductor devices – Mechanical and climatic test methods – Part 5: Steady-state temperature humidity bias life test IEC 60749-6, Semiconductor devices – Mechanical and climatic test methods – Part Storage at high temperature IEC 60749-1 5, Semiconductor devices – Mechanical and climatic test methods – Part 15: Resistance to soldering temperature for through-hole mounted devices IEC 60749-20, Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat IEC 60749-21 , Semiconductor devices – Mechanical and climatic test methods – Part 21:Solderability IEC 60749-23, Semiconductor devices – Mechanical and climatic test methods – Part 23: Hightemperature operating life IEC 60749-25, Semiconductor devices – Mechanical and climatic test methods – Part 25:Temperature cycling IEC 60749-26, Semiconductor devices – Mechanical and climatic test methods – Part 26:Electrostatic discharge (ESD) sensitivity testing – Human body model (HBM) IEC 60749-28, Semiconductor devices – Mechanical and climatic test methods – Part 28:Electrostatic discharge (ESD) sensitivity testing – Charged device model (CDM) – Device level 3 Terms and definitions For the purposes of this document, the following terms and definitions apply. ISO and IEC maintain terminological databases for use in standardization at the following addresses: • IEC Electropedia: available at http://www.electropedia.org/ • ISO Online browsing platform: available at http://www.iso.org/obp 3.1 failure mode classification of a fault phenomenon which causes product failure Note 1 to entry: Disconnection, a short circuit,...