IEC 60749-15-2020 Semiconductor devices – Mechanical and climatic test methods – Part 15: Resistance to soldering temperature for through-hole mounted devices.
This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering. In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more controllable conditions. This procedure determines whether devices are capable of withstanding the soldering temperature encountered in printed wiring board assembly operations, without degrading their electrical characteristics or internal connections. This test is destructive and may be used for qualification, lot acceptance and as a product monitor. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board. This procedure does not simulate wave soldering or reflow heat exposure on the same side of the board as the package body. 2 Normative references The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-2-20, Environmental testing — Part 2-20: Tests — Test T: Test methods for solderability and resistance to soldering heat of devices with leads IEC 60749-3, Semiconductor devices — Mechanical and climatic test methods — Part 3:External visual examination IEC 60749-8, Semiconductor devices — Mechanical and climatic test methods — Part 8:Sealing 3 Terms and definitions For the purposes of this document, the following terms and definitions apply. ISO and IEC maintain terminological databases for use in standardization at the following addresses: • IEC Electropedia: available at http://www.electropedia.orgl • ISO Online browsing platform: available at http://www.iso.org/obp 3.1 colophony DEPRECATED: rosin natural resin obtained as the residue after removal of turpentine from the oleo-resin of the pine tree, consisting mainly of abietic acid and related resin acids, the remainder being resin acid esters Note 1 to entry: Rosin” is a synonym for colophony. and is deprecated because of the common contusion with the generic term “resin”. 3.2 lead-free solder alloy that does not contain more than 0,1 % lead (Pb) by weight as its constituent and is used for joining components to substrates or for coating surfaces [SOURCE: IEC 60194:2015, 75.1904, modified — The words “as its Constituent” have been added to the definition.] 3.3 resistance to soldering heat ability of device to withstand the highest temperature of the termination or lead in soldering process, within applicable temperature range of solder alloy 4 Test apparatus 4.1 Solder pot A solder pot of sufficient size to contain at least 1 kg of solder shall be used. The solder pot dimensions shall allow full immersion of the leads without touching the bottom. The apparatus shall be capable of maintaining the solder at the temperature specified in Table 1.IEC 60749-15 pdf download.IEC 60749-15 pdf download.